IIBEC 2020 Building Enclosure Symposium+ Goes All Virtual

Back To News
October 12, 2020

(October 6, 2020) After careful consideration, the International Institute of Building Enclosure Consultants (IIBEC) announced today that the annual Building Enclosure Symposium (BES+) will be presented in an all-virtual format over two weeks in mid-November.

Due to the virtual format of the revised event, participants will be able to attend more live educational sessions and have more time to network with exhibitors. The content and exhibit booths will be available through December 20, 2020, allowing attendees even more opportunities to engage with the presenters and their fellow attendees. The original dates of the BES+ were November 21-22, 2020.

“While we will miss shaking your hand and looking you in the eye with a welcoming smile, true to the spirit of IIBEC and our heartfelt commitment to the industry, we are excited about the opportunity that this year’s virtual symposium will offer attendees,” said IIBEC President Scott Hinesley, RRC, PE.

“Although we would prefer to meet in person, our top priority is the health and safety of our attendees and staff. With continued governmental restrictions on gatherings and ongoing corporate travel bans, we quickly recognized how these unprecedented times are affecting our attendees who come from all over North America,” said IIBEC CEO Brian Pallasch.

Each day includes two one-hour educational sessions and one-hour of dedicated networking with exhibiting companies, allowing for flexibility with personal schedules. The chat and Q&A are live to promote the networking that participants have come to expect at IIBEC events.

Due to the increased need for technical content, the meeting will be offered at a reduced price. The virtual event includes twelve sessions (15 speakers) and over 20 exhibiting companies for only $195 member / $229 nonmember. Take advantage of this early bird pricing.

The new schedule is available on IIBEC’s website at https://iibec.org/2020-iibec-bes/#ts20schedule.